Thermal Paste Iceberg Thermal FUZEIce Plus

Iceberg Thermal FUZEIce Plus is a high-performance thermal paste formulated for efficient heat transfer between electronic components. With a thermal conductivity of 13 W/m·K and a density of 2.6 g/cm³, this 7 g syringe of green thermal grease supports stable cooling for CPUs, GPUs and other heat-generating devices while remaining usable across a wide operating temperature range up to 200°C.

Advantages

FUZEIce Plus combines high thermal conductivity with a low-temperature application profile to enable efficient heat dissipation and potential for higher clock speeds. The included precision applicator and angled spreader simplify application and reduce mess. The compound is rated for an extended operating range (−50 to 200°C) and is formulated to remain effective for long-term use.

Suitable for

• CPU cooling
• GPU cooling
• Heat sinks and small electronic components

Key specifications

• Thermal conductivity: 13 W/m·K
• Weight: 7 g (0.007 kg)
• Density: 2.6 g/cm³
• Operating temperature: −50 to 200 °C
• Colour: Green
• Brand / MPN / EAN: iceberg thermal / BLACKICEP8G-00A / 1230000071727

How to use

Clean contact surfaces thoroughly and remove old thermal compound. Apply a small, pea-sized amount of FUZEIce Plus to the centre of the CPU or component. Mount the cooler and allow the pressure to spread the paste for an even, thin layer. If desired, the included angled spreader can be used to distribute the paste manually for a uniform coating.

Recommendations

Use minimal paste to avoid overflow onto the socket or PCB. Reapply FUZEIce Plus when replacing coolers or if thermal performance degrades; typical long-term stability allows for infrequent reapplication under normal operating conditions.